Industrial Motherboards te hi a thuk zawka siam a ni | Industrial-Grade Scenario-a innghat Solution hrang hrangte Hub
Service chungchang tlangpui
Industrial computing power hub-a core carrier a nih angin industrial motherboard-te tana customized service hian industrial automation leh intelligent equipment ang chi scenario hrang hrangte mamawh hrang hrangte a ngaihtuah a ni. A delivery a ni end-to-end, thuk taka siam danglam processor architecture, hardware architecture, schematic design, PCB design, leh system adaptation te a huam a ni.
Kan siam chhuah exclusive industrial motherboard customization solutions zawm chungin industrial-grade standard hmanga tih a ni. Chipset thlan, interface tihzauh, wide-temperature leh anti-vibration design te bakah core capabilities te hmang tangkaiin, high-temperature-resistant ang chi components hmangin boruak khirh takah hmanrua te chu a nghet taka a thawh theih nan kan enkawl a ni.
Customization theihna te
Hardware Customization hmanga siam a ni
Chip leh Computing Power Configuration te a awm bawk
Customization of a support bawk Intel/AMD/domestic chips hmanga siam a ni. Metallurgy, mining leh project dang application scenario atanga thlirin low-power emaw high-performance processor te chu match a ni a, memory chu SSD/HDD/flash storage combination nen synchronized a ni a, hei hian computing power redundancy a awm loh nan a ti a ni.
Interface leh Expandability te a awm bawk
Fixed interface constraints atanga chhuakin, slot hrang hrang a support a, chu chu PCIe/PCI/Mini PCIE hmanga tih a ni, graphics card, network card, storage expansion card, etc. te pawn lam atanga inzawmna siam theihna, graphic processing, high-speed network communication, large-capacity storage, etc. mamawh hrang hrang phuhrukna tur Customization neih chhung hian interface hrang hrang a tul angin thuam theih a ni:
Serial Port hrang hrang (COM Ports) te chu: Anti-interference chak tak leh stability sang tak a nei a, PLC controller ang chi device connect na atan a tha hle. Standard hman tlanglawn ber chu RS232/RS485 a ni a, industrial scenario hrang hranga data thawn chhuah danah a insiamrem thei a ni.
USB Interface hrang hrangte chu: Plug-and-play awlsamna pe thei a, common USB2.0 atanga high-speed USB3.0 leh a aia sang version thlengin a awm a, industrial keyboard, data collector leh peripheral dangte nena connection a support bawk.
Hengte hian industrial equipment te tha taka hman theihna a tichak a ni.
Form Factor leh Protection Design siam a ni
Motherboard hi common size-ah 3.5-inch, 5.25-inch, emaw specification-ah te pawh siam theih a ni ATX, Micro-ATX, leh ITX te a awm bawk hmanrua hmun leh layout mamawh a zirin, industrial device hrang hrangte chhungril structure nena inmil takin a insiamrem thei a ni.
Thil hman tur leh venhimna: Industrial-grade components temperature sang leh moisture laka inven theihna tur thlan a ni a, hei hi environment complex-a motherboard hnathawh dan nghet tak a nih theih nan a ni. Electromagnetic interference tihtlem nan "well-shaped mesh wiring" ang chi electromagnetic compatibility (EMC) design hi hman a ni. Motherboard thenkhatah chuan buffer components, rubber cushioning pads nei protective frame ang chi te dah a ni a, hei hian pawn lam atanga chhiatna a thlen tlem theih nan, all-round reliability a pe a ni.
Model-a inthlak danglam theihna: Device chi hrang hrang 10 chuang nena inmil, rack-mounted, embedded, fanless, rugged portable, leh industrial panel PC te pawh a awm. Wide-temperature adaptation hi standard a ni a, operating temperature extreme zawk atan optional configuration a awm bawk.
Software & System inzawmkhawmna a ni
Operating System Install hmasak ber tur a ni
Real-time system ang chi adaptation leh debugging a support bawk Windows, Linux leh Ubuntu te a ni. Customer-specific industrial control software (configuration software ang chi) a inzawm khawm a, delivery hmain driver debugging a ti zo a, project deployment cycle a ti tawi.
Modular Function tihhmasawn dan tur
Industrial PC functions modular development hian system chu independent functional module-ah a then a, chung zingah chuan CPU, storage, communication, GPIO control module, etc. Standardized design hmang hian module te chu a tul angin a inzawm khawm thei a-entir nan, PCIe/Mini PCIe interface hmangin function card hrang hrang inzawmkhawm a ni. Development hian module compatibility leh expandability a ngaih pawimawh ber a, hei hian development cycle tawi zawk a siam a, post-sales maintenance upgrades a ti awlsam a, industrial automation leh intelligent equipment ang chi scenario hrang hrangah a insiamrem thei bawk.
Structural Customization hmanga siam a ni
Dimension leh Specification hrang hrang
Standard size (ATX/Micro-ATX/Mini-ITX) leh special customized dimension a pe a, industrial tablet leh control cabinet ang chi equipment space-te nena inmil-eg, energy power station thar atana wall-mounted design compact tak tak te a pe bawk.
Cooling leh Invenna
Fanless passive cooling, fan module hmanga active cooling, interface venhimna, EMI shielding, etc. A hmang a, cooling leh venhimna design dik tak hmangin industrial motherboards te hian an MTBF (Hlachhamna inkar hun chhung)≥100,000 darkar boruak khirh takah chuan, intelligent manufacturing leh energy exploration ang chi field pawimawh tak takte hun rei tak chhunga rintlak operation mamawh phuhrukna tur a ni.
Customization Services kalpui dan kimchang
Thil mamawh thlirletna leh Specification sawifiahna
Application scenario (eg, industrial control, medical equipment), performance indicator (CPU/memory configuration), interface chi hrang hrang (USB/COM/PCIe, etc.), leh environment mamawh (high-temperature resistance, dust protection, etc.) te chiang zawka sawi.
Solution Design leh Review
Hardware Design siam dan tur: 1.1. Processor architecture leh circuit schematics te chu ruat la, PCB layout leh layer count (eg, 4-layer/6-layer/8-layer boards) te ruahman bawk ang che.
3.2.2 Thil tih theih dan tur tehfung: 1.1. Solution man, technical harsatna, leh a inmilna (eg, hmanraw awm tawh nena inmil theihna) enfiah leh rawh.
Prototype siam leh test dan
PCB Prototype siam dan: 1.1. Solder components leh prototype motherboard assembly tihfel a ni.
Testing Items te chu: Functional stability (booting/interface debugging), boruak inthlak danglam theihna (high-low temperature leh vibration test), leh electromagnetic compatibility (EMC testing) te a ni.
Optimization leh Iteration tih a ni
Test result (eg, signal interference, heat dissipation issues) atanga design siam danglam, component thlan emaw PCB routing emaw siamthat.
Mass Production leh Delivery a ni
Mass production hmain verification atan small-batch trial production neih thin tur a ni. Confirmation hnuah production scale up la, chutih rual chuan technical documents (schematics, drivers) leh after-sales support te pe bawk ang che.
Full-Cycle rawngbawlna a ni
Pechhuak Darkar 7×24 chhung online hmanga tanpui theih a ni, telephone service, leh siamthat hna te a ni. Firmware upgrade leh compatibility tihpunna tur support. Professional technician-te chuan hmanrua dam chhung zawnga hnathawh dan nghet tak neih theih nan leh sumdawnna kalpui zel tur venhimna atan an chhang let nghal a ni.
Customized Process a ni
